NVIDIA, TSMC

NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.
Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
Nvidia Continues Strong Demand for Taiwan Semiconductor's Advanced Packaging Despite Technology Shifts
Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use CoWoS-L for Blackwell chip.
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia's visit to SPIL highlights its emphasis on advanced packaging
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packaging.
NVIDIA CEO urges Taiwan to invest in AI due to rising demand for advanced packaging
Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly increasing in the era of artificial intelligence (AI). He noted that AI will become a mainstream industry and urged active investment during his visit to Taiwan.
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia Just Made a Huge AI Chip Shift--And It Could Shake Up the Entire Industry
Nvidia ( NASDAQ:NVDA) is making a major shift in its AI chip packaging strategy, transitioning from CoWoS-S to CoWoS-L as it ...
The Taipei Times8h
Nvidia CEO to miss Trump inauguration, unlike peers
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking ...
tom's Hardware on MSN2d
Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L packaging
Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.