EDA and IP revenue increased 8.8% in Q3 2024, dragged down from the double-digit growth of recent quarters by a softening in ...

Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path to 1µm L/S.

The Arm SMCF introduces a modular, programmable solution designed to address the growing need for visibility and control in ...

Emerging standards include JTAG 1149.1 or 1149.6, SPI and J2C (JTAG to CPU). Each of these plays a crucial role in ensuring ...

Ensuring the quality of silicon and organic interposers is becoming harder as the number of signals passing through them ...

Increasing engineering efficiency will require lowering the AI expertise barriers for everyone in the chip industry.

Rising complexity and heterogeneous integration are reshaping test methodologies and fault coverage, but challenges persist.

The odds for independent success are stacked against startups. “Most IC and systems companies limit how invested and ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride ...

A new technical paper titled “Open-Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna. “Since 2013, the PULP (Parallel Ultra-Low ...