Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan. 08, 2025 (GLOBE ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron , which has worked in partnership with Nvidia for several years, was named by CEO Jensen Huang during his keynote ...

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

The US semiconductor giant revealed during its fiscal Q1 2025 earnings call it plans to introduce HBM4 memory products in ...

Hankook Semiconductor, which holds the world's number one market share in TC bonders, began supplying Micron in April 2024, ...

Micron Technology (NASDAQ:MU) said on Wednesday that it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility adjacent to its current plants in Singapore. The U.S. tech ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...