A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly.

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform,” 2024 IEEE 26th Electronics ...