ARQUIMEA has demonstrated BrainChip’s Akida with a Prophesee event-based Metavision® camera on a low-power drone to detect ...

The introduction of LPDDR5 in 2019 marked a major leap, delivering up to 6400Mbps and adding features like in-line ECC for ...

Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features such as higher bandwidth, power ...

Creonic, the leading provider of high-performance IP cores for ASIC and FPGA technologies, has unveiled a bold new brand ...

Siemens Digital Industries Software today announced that Secafy has adopted Siemens’ full IC design flow consisting of its ...

European and Japanese suppliers of semiconductor equipment are set to be targeted in the next round of tariffs by the US.

The ODT-PVT-ULP-001C-3 provides simple and seamless integration, requiring just a single core-voltage supply and a digital ...

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), provides an overview of the ...

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and ...

Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node ...

Announcing Orthogone as Blackcore Labs Partner, this collaboration integrates Orthogone’s industry-leading Ultra-Low Latency IP cores with Blackcore’s high-performance Intel and AMD-based servers, ...

Defacto Technologies, a key player in EDA solutions for SoC design, announces the update of its SoC Compiler software to ...